Capital Lines
What is Hepco?
HEPCO, Inc. has designed and built component lead forming equipment in its Sunnyvale, California facility since the early 1970’s. Working with some of the world’s largest sub-contract assemblers and OEMs here in the fast-paced Silicon Valley environment places HEPCO in a unique position in the industry.
Our vast client list encompasses the smallest start-up companies to the largest in EMS, aerospace and semiconductor manufacturing, for whom we provide lead forming solutions from single-stroke forming to bowl-fed systems.
HEPCO has recently expanded its line to include PCB de-paneling equipment for routed PCBs. Also introduced is a new BGA Sphere Placement System which uses vacuum pick-up and placement of spheres for an entire array at once, and provides a mechanically-correct method of bumping or reballing BGA components.
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